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(PUR.L) Pure Wafer PLC Buy/Sell
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| Date/Time | Headline | Source |
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| 18-03-10 | RNS |
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RNS Number : 7642I Pure Wafer PLC 18 March 2010 18 March 2010
PURE WAFER PLC ("Pure Wafer" or "the Company") Interim Results for 6 months ended 31 December 2009 Pure Wafer plc, the provider of high quality silicon wafer reclaim services for many of the world's leading semiconductor manufacturers as an integral part of their cost control programmes, today reports its interim results for the 6 months to 31 December 2009.
HIGHLIGHTS
· EBITDA loss £0.5m (2008: profit £0.3m) · Pre-tax loss £3.1m (2008: £2.7m)
· Net cash outflow from operating activities £1.8m (2008: inflow £1.7m) Operational Highlights
Stephen Boyd, Chairman, Pure Wafer, commented, "We are pleased to report the continued recovery of the semiconductor market together with the subsequent increasing volume sales of our wafer reclaim services. Whilst pricing pressure remains, our cost reduction actions have resulted in a lower cost of manufacture of our product."
ENQUIRIES
Peter Harrington, Chief Executive
PURE WAFER PLC ("Pure Wafer" or "the Company") Interim Results for 6 months ended 31 December 2009 Chairman's Statement Introduction During the period to 31st December 2009 the semiconductor industry continued its upturn from the lows of early 2009 and we have seen a welcome recovery in volume trading from all the geographical regions in which we are active. The pricing pressure that we experienced during the downturn is still with us, and although price erosion has slowed, prices did not show an upturn in the period under review. The severe market conditions have taken its toll on some of our competitors with six wafer reclaim suppliers exiting the market, due to either insolvency or a change in strategy. During the period the weakening of sterling against the US dollar has mitigated some of the effects of our falling selling prices and revenues, when converted to sterling as our reporting currency. Operational During the period we saw volume business continue its recovery, with volume sales when expressed as 300mm equivalents up 28% compared to the prior period, however this is still 11% down on the comparative period to 31st December 2008. This increased volume allowed both manufacturing sites to return to full time working during the period following seven months of short time working. Our cost reduction activities have continued to be successful, with reductions across all areas, including consumable costs to some of our fixed costs. This has now reduced Pure Wafer's manufacturing costs by in excess of 40% to its lowest ever cost per wafer without affecting either our manufacturing output capability or the quality of our product. We continue to work on cost reduction programmes. Financial performance
· EBITDA loss £0.5m (2008: profit £0.3m) · Pre-tax loss £3.1m (2008: £2.7m)
· Net cash outflow from operating activities £1.8m (2008: inflow £1.7m) The board are encouraged by the actions of the management team during the period to reduce the impact of the market conditions by reducing costs across all sectors of the business as well as maximising revenue during a difficult trading period. Group funding During the period we successfully negotiated with our bank and asset funders a financial restructuring package. The financial agreements comprised of rescheduling all the Company's existing debt over a six year period which includes up to two years of capital repayment holidays, with initial capital repayments due to commence as scheduled in July 2010, together with an additional overdraft facility of up to £1.4million. The Company continues to trade within its facilities. As a condition of the financial restructuring, and to demonstrate their commitment and confidence in the business, certain directors and senior management invested £0.30million of cash into the business by way of a placement of shares. The open offer to shareholders which was made during August 2009 was well subscribed, raising £1.16million of funds. This together with the placing of excess shares which raised £0.53million resulted in a total of £1.99million, before costs, being raised. The financial restructuring and take up of the open offer and placing demonstrates the commitment that the bank, asset funders, shareholders and management have to Pure Wafer and shows a confidence in the recovery of the business, and I would like to thank them for their support. New products We have recently entered the solar photovoltaic market utilising the scrap material from our wafer reclaim services to create solar cells and panels. We are excited about the prospects of this move into the growth area of the renewable energy market, whilst utilising the fixed cost elements of our wafer reclaim business in manufacturing our new products. We will continue to explore further new opportunities outside our core business of wafer reclaim, to enhance our portfolio of products, looking at areas where we have certainty of the end market, where we will not incur significant research and development costs and which are compatible with our existing core skills and world-class manufacturing equipment and facilities. Management During the period we strengthened our board with the appointment of Jerry Winters as executive director responsible for our US operations. This appointment reflects the growing importance of the US market to the Pure Wafer Group. Giles Clarke stepped down from his position as non-executive director having served on the Pure Wafer board since November 2004. I would like to thank Giles for the important contributions he made to Pure Wafer, both in his role as former Chairman of the Company and as a Non-Executive Director. Outlook Although it is too early to be confident about a sustained return to growth, recent trading since the period end, together with positive news of a long term industry recovery, are encouraging signs from which we draw confidence for continued volume recovery. In January I am pleased to report we were EBITDA positive and our entry into the solar market is an exciting move for Pure Wafer and we are confident that this will provide additional revenue streams. This, together with our additional funding, gives Pure Wafer a strong foundation on which to move forward. Stephen Boyd Chairman 18 March 2010
PURE WAFER PLC Interim Results for 6 months ended 31 December 2009 Consolidated Statement of Comprehensive Income
3 Loss per share
The results stated above arose entirely from continuing activities.
PURE WAFER PLC Interim Results for 6 months ended 31 December 2009
Consolidated Balance Sheet
PURE WAFER PLC Interim Results for 6 months ended 31 December 2009 Consolidated Cash Flow Statement
Consolidated Statement of Recognised Income and Expense
PURE WAFER PLC Interim Results for 6 months ended 31 December 2009 Notes to the Accounts
The information for the year ended 30 June 2009 does not constitute statutory accounts as defined by the Companies Act 2006. A copy of the statutory accounts for the year ended 30 June 2009 has been delivered to the Registrar of Companies, upon which an unqualified audit report was given. The annual financial statements of Pure Wafer Plc are prepared in accordance with IFRS as adopted by the European Union. These interim results are prepared on the basis of the accounting policies which the company will use in preparation of the financial statements for the year ended 30 June 2010. There are no changes from the policies disclosed in the 2009 financial statements. Going concern The group's business activities, together with the factors likely to affect its future development, performance and position, are set out in the Chairman's Statement on page 2. The directors have assessed the balance sheet and likely future cash flows of the company and group at the date of signing the audit report and on this basis have concluded that it is appropriate to prepare the interim results on a going concern basis. The directors have considered the company's performance to date and reviewed the cashflow forecasts for the forthcoming period. The challenging conditions in the semiconductor market make the timing of the recovery difficult to predict. Although cash will need to be tightly controlled, the directors believe the new facilities will be sufficient for the business to continue trading for the foreseeable future. In forming the conclusion about the going concern basis, the directors have considered all the forgoing information.
The basic earnings per share is calculated by dividing profit attributable to ordinary shareholders by the weighted average number of ordinary shares in issue during the year. In the period the company issued additional shares of 99,711,511 and granted warrants over 42,293,889 shares. These numbers have been used to restate the comparatives. For diluted earnings per share, the weighted average number of ordinary shares in issue is adjusted to assume conversion of all dilutive potential ordinary shares. Earnings per share have been calculated as follows:
Weighted average number of ordinary shares: Unadjusted earnings £(3,066) £(2,726) £(5,292) Earnings per share 6 months ended 31 6 months ended Year ended 30 June 2009 December 2009 31 December 2008 Basic (2.43)p (2.16)p (4.19)p Basic diluted (1.82)p (1.62)p (3.14)p 4. Cash flows from operating activities 6 months ended 31 6 months ended Year ended December 2009 31 December 2008 30 June 2009 £'000 £'000 £'000 Loss for the period (3,066) (2,726) (5,292) Taxation - - - Finance expense 349 443 989 Finance income - (38) (40) Other non-cash gains and (75) 561 103 losses
Operating cash flows before
inventories
activities
A copy of this announcement is available from the Company Secretary, Pure Wafer plc, Central Business Park, Swansea Vale, Swansea, SA7 0AB. A copy is also available on the Company's website: www.purewafer.com. This information is provided by RNS The company news service from the London Stock Exchange END
IR KKODDDBKBBND More |
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| 12-03-10 | RNS |
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RNS Number : 5046I Pure Wafer PLC 12 March 2010
1. Identity of the issuer or the underlying issuer
of existing shares to which voting rights are
attached: ii
notification obligation: iii
(if different from 3.):iv
which the threshold is crossed or
reached: v
reached: vi, vii
8. Notified details:
A: Voting rights attached to sharesviii, ix
if possible using
the ISIN CODE
*Based upon ISC of 26,591,182, as at 01/06/09.
B: Qualifying Financial Instruments
Resulting situation after the triggering transaction
C: Financial Instruments with similar economic effect to Qualifying Financial Instrumentsxv, xvi
Resulting situation after the triggering transaction
Total (A+B+C)
9. Chain of controlled undertakings through which the voting rights and/or the financial instruments are effectively held, if applicable:xxi BlackRock Investment Management (UK) Limited - 25,161,406 (19.92%) Proxy Voting: 10. Name of the proxy holder: 11. Number of voting rights proxy holder will cease to hold: 12. Date on which proxy holder will cease to hold voting rights:
15. Contact telephone number: 020 7743 5741; stuart.watchorn@blackrock.com Note: Annex should only be submitted to the FSA not the issuer Annex: Notification of major interests in share
A: Identity of the persons or legal entity subject to the notification obligation
(including legal form of legal entities)
9AS
(at least legal representative for legal persons) B: Identity of the notifier, if applicable Full name Contact address Phone number & email Other useful information (e.g. functional relationship with the person or legal entity subject to the notification obligation) C: Additional information For notes on how to complete form TR-1 please see the FSA website. This information is provided by RNS The company news service from the London Stock Exchange END
HOLFLLFFBXFFBBB More |
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| 04-03-10 | RNS |
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RNS Number : 0554I Pure Wafer PLC 04 March 2010 Pure Wafer plc ("Pure Wafer" or the "Company") New Product launch Swansea based Pure Wafer plc, the provider of high quality silicon wafer reclaim services for many of the world's leading semiconductor manufacturers, is pleased to announce that it has completed the development of a new manufacturing process to convert the scrap material from its silicon wafer reclaim line into high efficiency single crystal photovoltaic cells (solar cells). The process has been developed in conjunction with Swansea University and with the assistance of Smart Grant funding from the Welsh Assembly Government. As this process utilises scrap silicon, the Directors believe that this is the lowest carbon method of producing high efficiency photovoltaic cells. In order to expedite the move to mass production of its solar offerings, Pure Wafer is prudently investing an initial amount in equipment to manufacture solar panels from its own solar cells thus providing a wholly UK manufactured product. These products will enable Pure Wafer to offer complete solar systems and solutions to its customers, ranging from single dwellings to large public and commercial buildings.
Pure Wafer has started to receive initial orders for its new products and services, and the level of interest and enquiries are encouraging. The Pure Wafer board is excited about the prospects of this move into the renewable energy market, through its solar offerings and the development of associated products, whilst maintaining its focus on the core business of wafer reclaim services to the world's major semiconductor manufacturers.
Peter Harrington/Stephen Boyd Background information on the solar market Climate change and the limited supply of fossil fuels have demanded urgent action to generate renewable energy. The photovoltaic market is expected to grow rapidly in the next 20 years with the worldwide solar market already exceeding $30 billion with over 60% of that expended in Europe (Source: Crosslink Capital). The UK market grew by 25% last year and the Renewable Advisory Board are predicting that it will reach £1 billion per annum by 2016 aided by government initiatives, including the feed-in tariff which is set for introduction in April 2010. This information is provided by RNS The company news service from the London Stock Exchange END
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The articles are all recent from feb/march 2010. The source is SEMI association. Try www.semi.org
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SQ - what is the date of this article and source please?
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The semiconductor industry is heading for growth this year according to SEMI which is the industry global association.
According to SEMI, spending on fabrication will increase by 88% to $30.9 billion when compared to last years spending of $16.4 billion. In the second half of 2009 there has being an uplift in the silicon wafer shipment when compared with the first half of 2009, as indicated below. 1st Q 2nd Q 3rd Q 4th Q Area Shipped 940 1686 1972 2109 (MSI) MSI = million square inches. As you can see from above the shipment of wafers has more than double in the 4th quater of 2009 when compared with the 1st quarter of 2009. This is very good news for Pure wafer that the semi-conductor industry is heading for growth as the world economy recovers. The fabrication plant owners must be very confident to double the spending on fabrication plants, facilities, equipment etc etc. Little bitg of information about what silicon wafers are used for. Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or "chips" are fabricated. |
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